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    Title :

    Optical and Package Design Issues for Chip-to-Chip Free-Space Optical Interconnections



    Conference:

    Summer topical meeting, Hybrid optoelectronic integration and packaging ; 1993 ; Santa Barbara; CA



    Publication date :

    1993-01-01


    Size :

    2 pages


    Remarks:

    Shelved at "Leos 1993 Summer topical meeting digest on optical microwave interactions" IEEE cat no 93TH0549-6



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English





    Alignment Considerations in the Package Design of Optical Interconnections

    IEEE; Lasers and Electro-Optics Society / IEEE; Components, Hybrids and Manufacturing Technology Society | British Library Conference Proceedings | 1993