1–16 von 16 Ergebnissen
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    High temperature potential of flip chip assemblies for automotive applications

    Braun, T. / Becker, K.F. / Sommer, J.P. et al. | Tema Archiv | 2005

    Optical data links for automotive applications

    Kibler, T. / Zeeb, E. | Tema Archiv | 2004

    Model for BGA and CSP reliability in automotive underhood applications

    Lall, P. / Islam, N. / Suhling, J. | Tema Archiv | 2003

    Lead-free solder bumping process for high temperature automotive application

    Teutsch, T. / Blankenhorn, R.G. / Zakel, E. | Tema Archiv | 2003

    Analysis of field loads in automotive ECUs and MEMS sensors

    Pustan, D. / Fischer, S. / Wilde, J. | Tema Archiv | 2007

    Multichip SMT power package for automotive market

    Paulasto, M. / Wieser, H. / Hauck, T. et al. | Tema Archiv | 2000

    MEMS sensor multi-chip module assembly with TAB carrier pressure belt for aircraft flight testing

    Kim, N.P. / Holland, M.J. / Tanielian, M.H. et al. | Tema Archiv | 2000

    ICAs for automotive applications in higher temperature ranges

    Detert, M. / Herzog, T. | Tema Archiv | 1999

    Formation of electrical contact through an Alodine coating

    Wehr, A. / Hardee, H.C. / Aukland, N.R. et al. | Tema Archiv | 1998

    High-reliability silver-bearing thick film conductors for automotive applications

    Yamamoto, K. / Abou, S. / Uchida, S. et al. | Tema Archiv | 1992

    Plastic ICs for military equipment cost reduction challenge and feasibility demonstration

    Brizoux, M. / Lerose, S. / Chadebec, G. et al. | Tema Archiv | 1990