Failure of soldered Pd/Ag conductors with surface mounted components after thermal cycling are often observed as vertical cracks through the conductor at the edge of the solder joint. The crack are related to Sn penetration and intermetallic formation with the conductor. Failures with Pt/Ag conductors are often near the solder/conductor interfacial region, and may be associated with the growing Pb-rich phase at this boundary. By careful consideration of circuit design, it is possible to improve thermal cycling performance of the circuit even with a Pd/Ag conductor, although the Pt/Ag conductor provides a wider design window than Pd/Ag conductors. High density Pd/Ag conductor shows a good performance with actual hybrid circuit.
High-reliability silver-bearing thick film conductors for automotive applications
Silberhaltige Dickschichtleiter hoher Zuverlässigkeit in der Fahrzeugelektronik
1992
7 Seiten, 15 Bilder, 4 Tabellen, 7 Quellen
Aufsatz (Konferenz)
Englisch
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