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    Wafer-level LED-SiP based mobile flash module and characterization

    Lin, Jyh-Rong / Ng, Tuen-Yi / Wang, Zhaoxin et al. | Tema Archiv | 2012

    UV LEDs reliability tests for fluoro-sensing sensor application

    Arques-Orobon, F.J. / Nunez, N. / Vazquez, M. et al. | Tema Archiv | 2014

    Ultra high reliable spacecraft computer system design considerations

    Rayapati, V.N. / Mukedkhar, D. | Tema Archiv | 1992

    Tin whisker analysis of an automotive engine control unit

    George, Elviz / Pecht, Michael | Tema Archiv | 2014

    Timing analysis of expedient voting and runahead

    Krishna, C.M. | Tema Archiv | 1994

    Technologies and reliability of modern embedded flash cells

    Sikora, A. / Pesl, F.P. / Unger, W. et al. | Tema Archiv | 2006

    Strain depending reliability of automotive diodes

    Galateanu, L. / Stoica, M.G. / Popa, E. | Tema Archiv | 1998

    State of charge estimation for electric vehicle batteries using unscented kalman filtering

    He, Wei / Williard, Nicholas / Chen, Chaochao et al. | Tema Archiv | 2013

    Sequential environmental stresses tests qualification for automotive components

    Bahi, M.A. / Lecuyer, P. / Fremont, H. et al. | Tema Archiv | 2007

    Semiconductors in high temperature applications - a future trend in automotive industry

    Goroll, M. / Pufall, R. / Kanert, W. et al. | Tema Archiv | 2004

    Reliable power electronics for automotive applications

    Seliger, N. / Wolfgang, E. / Lefranc, G. et al. | Tema Archiv | 2002

    Reliability potential of epoxy based encapsulants for automotive applications

    Braun, T. / Becker, K.F. / Koch, M. et al. | Tema Archiv | 2005

    Reliability of MEMS - a methodical approach

    Muller-Fiedler, R. / Wagner, U. / Bernhard, W. | Tema Archiv | 2002

    Reliability aspects of semiconductor devices in high temperature applications

    Kanert, W. / Dettmer, H. / Plikat, B. et al. | Tema Archiv | 2003