Synonyme wurden verwendet für: encapsulation
Suche ohne Synonyme: keywords:(encapsulation)

1–35 von 35 Ergebnissen
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    Predicting, categorizing and intercomparing the lifetime of OPVs for different ageing tests

    Corazza, Michael / Krebs, Frederik C. / Gevorgyan, Suren A. | Tema Archiv | 2014
    Schlagwörter: Verkapseln

    Research project for reducing the noise of truck Diesel engines

    Feitzelmayer, K.F. / Schroeder, W. | Tema Archiv | 1979
    Schlagwörter: KAPSELUNG

    Concept for a chassis mounted capsule of engine and gearbox for heavy trucks

    Krisper, G.K. / Kratochwill, H.H. | Tema Archiv | 1979
    Schlagwörter: KAPSELUNG

    Engine encapsulation on 6-10 ton-trucks

    Stiglmaier, M. / Drewitz, H.J. | Tema Archiv | 1985
    Schlagwörter: VERKAPSELN

    Some aspects concerning noise reduction on diesel passenger cars

    Charzinski, H.P. / Hiereth, H. | Tema Archiv | 1979
    Schlagwörter: KAPSELUNG

    Embedded training: Can it be done with mirrors?

    Darfus, G.H. | Tema Archiv | 1986
    Schlagwörter: KAPSELUNG

    Powertrain co-simulation on top of standards

    Störmer, Christoph / Malz, Christoph / Mitrohin, Corina et al. | Tema Archiv | 2013
    Schlagwörter: Einkapselung

    Some aspects concerning noise reduction of passenger cars with diesel and gasoline engines

    Hiereth, H. / Charzinski, H.P. | Tema Archiv | 1979
    Schlagwörter: VERKAPSELN

    Reliability potential of epoxy based encapsulants for automotive applications

    Braun, T. / Becker, K.F. / Koch, M. et al. | Tema Archiv | 2005
    Schlagwörter: Verkapseln

    Reliability assessment of codlag system

    Tema Archiv | 1985
    Schlagwörter: VERKAPSELN

    Multilayer alumina substrates for ECU (automotive electronics)

    Sugai, K. / Matsumoto, H. / Shimojyou, Y. et al. | Tema Archiv | 1998
    Schlagwörter: keramische Kapselung , Wärmehaushalt (Kapselung)

    Stability of spore-based biosensing systems under extreme conditions

    Sangal, Abhishek / Pasini, Patrizia / Daunert, Sylvia | Tema Archiv | 2011
    Schlagwörter: Kapselung

    Silent power transmission systems for modern ships

    Gerstner, J. / Gallin, C. | Tema Archiv | 1990
    Schlagwörter: KAPSELUNG

    Reliability of commercial plastic encapsulated microelectronics at temperatures from 125 degrees C to 300 degrees C

    McCluskey, P. / Mensah, K. / O'Connor, C. et al. | Tema Archiv | 2000
    Schlagwörter: Wärmehaushalt (Kapselung)

    1990's whispering giants

    Mitchell, C. | Tema Archiv | 1985
    Schlagwörter: VERKAPSELN

    Der Weg zum leisen Fahrzeug

    Leinfellner, H. / Sommer, D. / Leiter, K. | Tema Archiv | 1996
    Schlagwörter: Kapselung

    Source characterization of the lower front-end of a diesel engine

    Johansson, Ö. / Agren, A. / Sundbäck, U. et al. | Tema Archiv | 1996
    Schlagwörter: Kapselung

    Selecting enclosures for offshore usage

    Deavin, I. | Tema Archiv | 1984
    Schlagwörter: KAPSELUNG

    Acoustic benchmark of different CO2 encapsulation strategies: Application examples and methods for the design of powertrain encapsulations

    Bertolini, C. / Caprioli, D. / Horak, J. et al. | Tema Archiv | 2013
    Schlagwörter: Einkapselung

    Variable emissivity through MEMS technology

    Garrison Darrin, A. / Osiander, R. / Champion, J. et al. | Tema Archiv | 2000
    Schlagwörter: Wärmehaushalt (Kapselung)

    Plastic encapsulated components for cars

    Hanreich, G. / Nicolics, J. / Musiejovsky, L. | Tema Archiv | 2001
    Schlagwörter: Wärmehaushalt (Kapselung)

    Noise reduction on trucks of 6 to 10 t gvw through engine encapsulation

    Drewitz, H. / Stiglmaier, M. | Tema Archiv | 1989
    Schlagwörter: KAPSELUNG

    The changing automotive environment: high-temperature electronics

    Johnson, R.W. / Evans, J.L. / Jacobsen, P. et al. | Tema Archiv | 2004
    Schlagwörter: Wärmehaushalt (Kapselung)

    Spherical particles for automotive powder coatings

    Satoh, H. / Harada, Y. / Libke, S. | Tema Archiv | 1998
    Schlagwörter: Verkapseln

    Qualification of a spin apply, photodefinable polymer for packaging of automotive circuits

    Wyant, J.L. / Schuckert, C.C. | Tema Archiv | 2000
    Schlagwörter: Flip-Chip-Verkapselung

    Model for BGA and CSP reliability in automotive underhood applications

    Lall, P. / Islam, N. / Suhling, J. | Tema Archiv | 2003
    Schlagwörter: Chip-Größen-Kapselung

    Lead free alloys for flip chip bumping

    Jung, E. / Aschenbrenner, R. / Kallmayer, C. et al. | Tema Archiv | 2001
    Schlagwörter: Chip-Größen-Kapselung

    Comparison of mechanical reliability of three underfill materials for flip chip bumps on high Tg PCB for automotive applications

    Fabbri, G. / Sartori, C. / Scarano, G. | Tema Archiv | 2001
    Schlagwörter: Chip-on-board-Kapselung

    Accelerated testing of flip chip packages under dynamic load

    Rau, I. / Miessner, R. / Liebing, G. et al. | Tema Archiv | 2001
    Schlagwörter: Flip-Chip-Verkapselung

    Enabling technologies for integrated system-on-a-package for the next generation aerospace applications

    Young, J.J. / Malshe, A.P. / Brown, W.D. et al. | Tema Archiv | 2002
    Schlagwörter: Wärmehaushalt (Kapselung)

    3-layered 3D flex based MCM: electrical characterization and reliability issues

    Morrison, W.B. / Railkar, T.A. / Malshe, A.P. et al. | Tema Archiv | 1999
    Schlagwörter: Wärmehaushalt (Kapselung)

    Results of assembly and reliability investigation of an MCM-L for an automotive application: electronic control unit

    Joly, J. / Lambert, D. / Ansorge, F. et al. | Tema Archiv | 1998
    Schlagwörter: Verkapseln , Chip-on-board-Kapselung