Integrated Modeling of Electronics Assembly Systems by Colored Petri Nets
Adhesive Flip Chip Bonding in a Miniaturized Spectrometer
Application of Dielectric Binary Mixtures in Electronic Cooling Nucleate Pool Boiling Regime
An Integrated Rapid Modeling Environment for Managing Wafer Fabrication Facilities
Micro-Jet Printing of Polymers and Solder for Electronics Manufacturing
A Practical Algorithm for Cyclic Hoist Scheduling in a PCB Manufacturing Facility
Vehicle Design and Results for HTS Maglev Model
Hygrothermal Reliability Evaluation of Plastic IC Packages with Computer-Aided Engineering Tools
Analyzing the Natural Resting Aspects of Plastic Parts in a Vibratory Bowl Feeder
A continuously variable ER damper with energy generation
Parameter Interactions in Stencil Printing of Solder Paste
The development of electrorheological fluids for an automotive semi-active suspension system
PCB Assembly Line Setup Optimization Using Component Commonality Matrices
Manufacturing Analysis of Underfill Processing for Low-Cost Flip Chip Assembly
Li-S batteries : the challenges, chemistry, materials, and future perspectives
High-Frequency Analog Integrated Circuit Design : Ravender Goyal, Ed. (Book review)
Yield Estimation Through Component Placement Accuracy Evaluation in Surface Mount PWB Assembly
Micro- Application of Non-Filled Adhesives for Precision Assembly in Microsystems Manufacturing
Book Review: Conductive Adhesives in Electronics Packaging (J. Liu)
Laser Removal of Flux Residue Before Chip Attachment to Board in a Flip Chip Assembly
ANALYSIS OF NATURAL RESTING ASPECTS OF COMPLEX PARTS
INTEGRATED NEURAL NETWORK MODELING FOR ELECTRONIC MANUFACTURING
Crystal Field Effect Studies in Pr~2~-~xCe~xCuO~4
Effect of a Coopeartive Transition on Magnetic Susceptibility of Single Molecules
A Study of Solderability and Solder Spreading for SMT Open Joints
Hierarchical Renormalisation and Stretched Exponential Relaxations
Novel Magnetic-Field-Induced Minigap and Transport in Coupled Double QuantumWells
RELIABILITY STUDY OF POLYMER ADHESIVE BUMP INTERCONNECTIONS
ANISOTROPIC ADHESIVES FOR FLIP-CHIP BONDING
Flow Boiling Heat Transfer of Electronic Chips in Horizontal Channels
Analysing the strategic implications of interconnect technologies
Tolerance analysis and synthesis across assemblies : state-of-the-art review
The Characteristics of Sand Dunes and its Stabilization in China
FLIP-CHIP INTERCONNECTION TO VARIOUS SUBSTRATES USING ANISOTROPIC CONDUCTIVE ADHESIVE FILMS
Solder Wire Die Bond Process Characterisation Study
ELECTRICAL CONDUCTION MODELS FOR ISOTROPICALLY CONDUCTIVE ADHESIVES
Analyzing the Natural Resting Aspects of a Component by its Centroid Solid Angle
Optimization of a Copper Pattern Plating Process with Planned Experimentation and Response Surface
Automatic Process Planning System for the Manufacture of Unpopulated Printed Circuit Boards
FLOW MODELING OF PQFP DURING TRANSFER MOLDING
EXPERIMENTAL STUDY OF SOLDER JOINT RELIABILITY IN A 256 PIN, 0.4 MM PITCH PQFP
Partnering with Customers by Capturing Their Voice