201–250 von 595 Ergebnissen
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Ihre Suche:
publisher:("World Scientific")

    Integrated Modeling of Electronics Assembly Systems by Colored Petri Nets

    Tam, H.-Y. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Adhesive Flip Chip Bonding in a Miniaturized Spectrometer

    Rusanen, O. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Application of Dielectric Binary Mixtures in Electronic Cooling Nucleate Pool Boiling Regime

    Lee, T.-Y. T. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    An Integrated Rapid Modeling Environment for Managing Wafer Fabrication Facilities

    Souza, R. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Micro-Jet Printing of Polymers and Solder for Electronics Manufacturing

    Hayes, D. J. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    A Practical Algorithm for Cyclic Hoist Scheduling in a PCB Manufacturing Facility

    Mak, R. W. T. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Vehicle Design and Results for HTS Maglev Model

    Wang, J. R. / Zhang, P. X. / Zhou, L. et al. | British Library Conference Proceedings | 1998
    Verlag: World Scientific , Singapore

    Hygrothermal Reliability Evaluation of Plastic IC Packages with Computer-Aided Engineering Tools

    Kuo, A.-Y. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Analyzing the Natural Resting Aspects of Plastic Parts in a Vibratory Bowl Feeder

    Ngoi, B. K. A. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    A continuously variable ER damper with energy generation

    Kim, K.S. / Choi, S.B. / Cheong, C.C. et al. | Tema Archiv | 1997
    Verlag: World Scientific , Singapore

    Parameter Interactions in Stencil Printing of Solder Paste

    Haslehurst, L. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    The development of electrorheological fluids for an automotive semi-active suspension system

    Weyenberg, T.R. / Pialet, J.W. / Petek, N.K. | Tema Archiv | 1996
    Verlag: World Scientific , Singapore

    Analysis of Underfill Encapsulation Curing Deformations on Flip Chip on Boaxd (FCOB) Package Reliability

    Pang, J. H. L. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    PCB Assembly Line Setup Optimization Using Component Commonality Matrices

    Dillon, S. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Manufacturing Analysis of Underfill Processing for Low-Cost Flip Chip Assembly

    Baldwin, D. F. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Li-S batteries : the challenges, chemistry, materials, and future perspectives

    Demir-Cakan, Rezan | TIBKAT | 2017
    Verlag: World Scientific] , New Jersey , London , Singapore

    The Electrical and Mechanical Properties of Electrically Conductive Adhesives in Pin-Through-Hole Applications

    Morris, J. E. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    High-Frequency Analog Integrated Circuit Design : Ravender Goyal, Ed. (Book review)

    Edwards, T. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    Yield Estimation Through Component Placement Accuracy Evaluation in Surface Mount PWB Assembly

    Shih, W. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    Micro- Application of Non-Filled Adhesives for Precision Assembly in Microsystems Manufacturing

    Bauer, A. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    Calculation of the Single Particle Green's Function of Interacting Fermions in Arbitrary Dimension via Functional Bosonization

    Kopietz, P. | British Library Conference Proceedings | 1996
    Verlag: World Scientific , Singapore

    Book Review: Conductive Adhesives in Electronics Packaging (J. Liu)

    Ruf, C. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Laser Removal of Flux Residue Before Chip Attachment to Board in a Flip Chip Assembly

    Lu, J. C. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    ANALYSIS OF NATURAL RESTING ASPECTS OF COMPLEX PARTS

    Ngoi, B. K. A. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    INTEGRATED NEURAL NETWORK MODELING FOR ELECTRONIC MANUFACTURING

    Marwah, Manish | Online Contents | 1996
    Verlag: World Scientific , Singapore

    Crystal Field Effect Studies in Pr~2~-~xCe~xCuO~4

    Rettori, C. / Sanjurjo, J. A. / Oseroff, B. S. et al. | British Library Conference Proceedings | 1996
    Verlag: World Scientific , Singapore

    Effect of a Coopeartive Transition on Magnetic Susceptibility of Single Molecules

    Luo, W. | British Library Conference Proceedings | 1996
    Verlag: World Scientific , Singapore

    A Study of Solderability and Solder Spreading for SMT Open Joints

    Teo, K. C. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    Hierarchical Renormalisation and Stretched Exponential Relaxations

    Souletie, J. | British Library Conference Proceedings | 1996
    Verlag: World Scientific , Singapore

    Novel Magnetic-Field-Induced Minigap and Transport in Coupled Double QuantumWells

    Lyo, S. K. / Simmons, J. A. / Harff, N. E. et al. | British Library Conference Proceedings | 1996
    Verlag: World Scientific , Singapore

    RELIABILITY STUDY OF POLYMER ADHESIVE BUMP INTERCONNECTIONS

    Rösner, Bela | Online Contents | 1995
    Verlag: World Scientific , Singapore

    ANISOTROPIC ADHESIVES FOR FLIP-CHIP BONDING

    Kivilahti, J. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Flow Boiling Heat Transfer of Electronic Chips in Horizontal Channels

    Kristiansen, H. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Analysing the strategic implications of interconnect technologies

    Dolan, T. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Tolerance analysis and synthesis across assemblies : state-of-the-art review

    Ngoi, Bryan Kok Ann | Online Contents | 1994
    Verlag: World Scientific , Singapore

    The Characteristics of Sand Dunes and its Stabilization in China

    Zhu, Z. / Yang, Y. / International Centre for Theoretical Physics et al. | British Library Conference Proceedings | 1989
    Verlag: World Scientific , Singapore

    FLIP-CHIP INTERCONNECTION TO VARIOUS SUBSTRATES USING ANISOTROPIC CONDUCTIVE ADHESIVE FILMS

    Watanabe, Itsuo | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Solder Wire Die Bond Process Characterisation Study

    Tan, C. U. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    ELECTRICAL CONDUCTION MODELS FOR ISOTROPICALLY CONDUCTIVE ADHESIVES

    Li, Li | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Analyzing the Natural Resting Aspects of a Component by its Centroid Solid Angle

    Ngoi, B. K. A. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Optimization of a Copper Pattern Plating Process with Planned Experimentation and Response Surface

    Poon, G. K. K. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Automatic Process Planning System for the Manufacture of Unpopulated Printed Circuit Boards

    Law, H. -W. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    FLOW MODELING OF PQFP DURING TRANSFER MOLDING

    Kuah, T. H. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    EXPERIMENTAL STUDY OF SOLDER JOINT RELIABILITY IN A 256 PIN, 0.4 MM PITCH PQFP

    Yeo, C. K. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    Partnering with Customers by Capturing Their Voice

    Morand, P. | Online Contents | 1995
    Verlag: World Scientific , Singapore