Trennen, was nicht zusammengehört. AutomotivePackage - ein neuer Ansatz auf IC-Ebene
Trends in conduction cooling for avionics
Trend bei Kfz-ICs: ASSPs statt ASICs. Autosar und Flex-Ray werden schon 2006 implementiert
Transient thermal impedance considerations in power semiconductor applications
TPMS and RKE operating in the same ISM frequency band
Total-dose hardness assurance for low Earth orbit
Toshiba announces world's first image recognition LSI for intelligent vehicle systems
Though digital IC's gain rapidly, today's automotive electronics remains mostly linear, discrete
Thomson-CSF develops new lightweight, electronically scanned radar for Rafale
The use of VHSIC/VLSIC gate array in improving military digital electronic hardware
The status of automotive electronics in Europe
Thermal characterisation and heat transfer analysis of a wire bond chip-on-board package
Thermal analysis of a high density TMOS used in an automotive solide-state relay
The prediction of the radiation-stimulated failure rate for integrated circuits
The past, present and future of EEE components for space application; COTS-the next generation
The monolithic A/D converter - an under-hood data acquisition interface
The monolithic A/D converter - An under-hood data acquisition interface