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encapsulation
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keywords:(encapsulation)
Memory chip packaging-an enabling technology for high-performance recce systems
3-layered 3D flex based MCM: electrical characterization and reliability issues
Multilayer alumina substrates for ECU (automotive electronics)
Optimal sizing of powder handling horizontal capsule pipelines
Microwave multichip modules using low cost microwave chip on flex packaging technology
Reduction in size and weight of electronic modules through the evolution of packaging design
Microcoil speed position sensor for automotive applications
Motorola and MEMMS: the way up to a surface micromachined accelerometer
The application of microtechnology to sensors for the automotive industry
Long life radioisotopic power sources encapsulated in platinum metal alloys
Simulation of modular mechatronic systems with application to vehicle dynamics
Reliability considerations for switched mode power supplies for use in railway applications
Source characterization of the lower front-end of a diesel engine