Microchannel Heat Pipe Cooling of Modules
Lightweight Electronic Enclosures Using Composite Materials
Advanced Standard Electronic Modules Format-E (SEM-E) Processes for Rapid Prototyping
Reliability Assessment of Multichip Module Technologies via the Tri-Service/NASA RELTECH Program
Assuring Known Good Die (KGD) for Reliable, Cost Effective MCMs
The IEEE Scalable Coherent Interface - An Approach for a Unified Avionics Network
Standard Hardware Acquisition and Reliability Program (SHARP) Advanced SEM-E Packaging
The Impact of Advanced Packaging Technology on Modular Avionics Architectures
The Design and Manufacturing Development of an Active Silicon Substrate MCM
Ultra-Reliable Digital Avionics (URDA) Processor
Electromagnetic Compatibility Effects of Advanced Packaging Configurations
The Demise of Plastic Encapsulated Microcircuit Myths
The Advanced Avionics Subsystem Technology Demonstration Program
Boitiers Composites pour Equipements Electroniques Aeroportes: Une Etude Technologique et CEM