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Yamaha's new battery management system for small EVs
Wirebonding on multilayer circuits for automotive applications using robust thick-film conductors
Widely tunable laser technologies: meeting the needs of tomorrow's networks [4652-31]
Wideband channelized receiver possibilities with 0.18 micron CMOS technology
Why use PEMs in military equipment: Users' response
Welding-induced alignment distortion in DIP LD packages: effect of laser welding sequence [4652-15]
W-band monolithic single sideband transceiver for automotive radar applications
Vying for Value: A Supplier's Perspective on the Competitive Advantage of Value Engineering
VTC's ICs guard against radiation three ways
VLSI microphotonics: issues, challenges, and prospects (Invited Paper) [4652-01]
Vibration-induced fatigue failures in bonding wires used in stacked chip modules
Vibration control of a wing box via reciprocal state space framework
VHSIC/VLSI capabilities for DOD?
VHSIC phase 2 technology and the EHF modem/controller
VHSIC: midterm report on a dynamic circuit program
VHSIC-insertion program begins to pay dividends
VHDL-AMS design for flight control systems
Verification of single event upset rate estimation methods with on-orbit observations (RAMs)
Vehicle Testing for Electromagnetic Compatibility
Vehicle instrument displays - the electronic revolution
Vehicle instrument displays - The electronic revolution
Validation Test Plan for AS4074 Linear Token Passing Multiplex Data Bus
Validation Test Plan for AS4074 Linear Token Passing Multiplex Data Bus
UV-visible sensors based on polymorphous silicon
UV-laser-based process for quantum well intermixing of III-V heterostructures [5451-86]
Using very high speed integrated circuits for army systems
Using test data to predict avionics integrity
User-oriented data processing considerations in linear array applications
Use of glass solder in fixing an optical fiber in a laser package [4652-17]
Use of checkout equipment for scientific satellite testing
US defence dependencies and commercial standards in the global semiconductor industry