Thermal characterisation and heat transfer analysis of a wire bond chip-on-board package
Thermal analysis of a high density TMOS used in an automotive solide-state relay
The Influence of Knowledge Accumulation on Buyer-Supplier Codevelopment Projects
Eine neue Fehlertoleranzmethode zur Verringerung des Flächenaufwandes von TMR-Systemen
Effect of post-mold curing of epoxy molding compound on wirebond reliability in a MOSFET
Dispersion and the worst case of thermal fatigue life of solder joints in vehicle electronic devices
Board-level characterization of 1.0 and 1.27 mm pitch PBGA for automotive under-hood applications
Assessment of need for solder in modeling potted electronics during gun-shot
An On-Chip Power Supply Regulator to Reduce the Switching Noise
Acceptance checking methods for UHF electronic components
6H-SiC transistor integrated circuits demonstrating prolonged operation at 500 deg C