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Armed forces communications and electronics association 28th annual convention
Reliability life cycle of a complex electronic airborne equipment
Zuverlaessigkeit am Beispiel der Flugzeugelektronik
Trends in failure survival techniques for avionic systems
Hi rel linear IC selection and specification procedures
Characteristics of devices and integrated circuits at 260 Cel for Navy applications
Random vibration screening of an airborne digital computer
Anwendungen der Mikroelektronik in der Eisenbahntechnik
Automotive electronics: designing custom ICs for a harsh environment
R and M 2000 and the Air Force acquisition process
Mechanical considerations for reliable interfaces in next generation electronics packaging
A performance measure for a VHSIC avionic system: mission dependent availability
Design of fail safe computer systems for railway control
Mikroelektronik wird zum Schlüssel der Wettbewerbsfähigkeit auf den Weltmärkten
QML (qualified manufacturing line): a method of providing high quality integrated circuits
Off-line quality control via yield constrained variability minimization in circuit design
Thermal analysis of a high density TMOS used in an automotive solide-state relay
Demonstrated reliability of plastic-encapsulated microcircuits for missile applications
Commercial-Components Initiative: Ground Benign Systems-plastic encapsulated microcircuits
A simple computational electromagnetic analysis example of electromagnetic coupling to pyro circuits
Thermal characterisation and heat transfer analysis of a wire bond chip-on-board package
A powertrain control SOI BiCMOS LSI for an automotive application
A case study of IC storage failures in Taipei trains
Multilayer alumina substrates for ECU (automotive electronics)
The past, present and future of EEE components for space application; COTS-the next generation
Soldered flip chip IC's in automotive applications
Alternative solders for flip chip applications in the automotive environment
Interfaces and error management trades for solid state recorders
SRAM based re-programmable FPGA for space applications
ICAs for automotive applications in higher temperature ranges
Wirebonding on multilayer circuits for automotive applications using robust thick-film conductors
Board-level characterization of 1.0 and 1.27 mm pitch PBGA for automotive under-hood applications
Ball grid array reliability assessment for aerospace applications
A new Ag/Pd conductor for automotive applications