Application of Polymer-Thick-Film-Technology (PTF) for Environmentally Friendly Electronic Devices
An Efficient Assembly Sequencing Heuristic for Printed Circuit Board Configurations
Thermal Management for the Robustness Improvement of Double Sided SMT Solder Reflow
Comprehensive Review of Natural and Mixed Convection Heat Transfer Models for Circuit Board Arrays
Parameter Interactions in Stencil Printing of Solder Paste
The development of electrorheological fluids for an automotive semi-active suspension system
THERMAL DISSIPATION CHARACTERISTICS OF A TAPE AUTOMATED BONDING ELECTRONIC PACKAGE
A REVIEW ON DIRECT LIQUID COOLING CHANNEL FLOW WITH SINGLE-PHASE FOR ELECTRONIC SYSTEMS
A Review on Cooling by Channel Flow Boiling for Electronic Systems
FLOW MODELING OF PQFP DURING TRANSFER MOLDING
EXPERIMENTAL STUDY OF SOLDER JOINT RELIABILITY IN A 256 PIN, 0.4 MM PITCH PQFP
Adhesive Flip Chip Bonding in a Miniaturized Spectrometer
Application of Dielectric Binary Mixtures in Electronic Cooling Nucleate Pool Boiling Regime
SMT Feeder Slot Assignment for Predetermined Component Placement Paths
Simultaneous Component Sequencing and Feeder Assignment for High Speed Chip Shooter Machines
A Simulation of Evaporating Meniscus-Driven Flow for Application to Electronics Cooling Design
The Solderability Evaluation of Surface Mount Components Through the Use of Wetting Balance Analysis
Book Review: Conductive Adhesives in Electronics Packaging (J. Liu)