101–120 von 230 Ergebnissen
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Ihre Suche:
publisher:("World Scientific")

    Application of Polymer-Thick-Film-Technology (PTF) for Environmentally Friendly Electronic Devices

    Fischer, T. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    An Efficient Assembly Sequencing Heuristic for Printed Circuit Board Configurations

    Moyer, L. K. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Thermal Management for the Robustness Improvement of Double Sided SMT Solder Reflow

    Lee, N. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Comprehensive Review of Natural and Mixed Convection Heat Transfer Models for Circuit Board Arrays

    Teerstra, P. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Parameter Interactions in Stencil Printing of Solder Paste

    Haslehurst, L. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    The development of electrorheological fluids for an automotive semi-active suspension system

    Weyenberg, T.R. / Pialet, J.W. / Petek, N.K. | Tema Archiv | 1996
    Verlag: World Scientific , Singapore

    THERMAL DISSIPATION CHARACTERISTICS OF A TAPE AUTOMATED BONDING ELECTRONIC PACKAGE

    Yang, L. Y. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    A REVIEW ON DIRECT LIQUID COOLING CHANNEL FLOW WITH SINGLE-PHASE FOR ELECTRONIC SYSTEMS

    Xu, G. P. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    A Review on Cooling by Channel Flow Boiling for Electronic Systems

    Xu, G. P. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    FLOW MODELING OF PQFP DURING TRANSFER MOLDING

    Kuah, T. H. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    EXPERIMENTAL STUDY OF SOLDER JOINT RELIABILITY IN A 256 PIN, 0.4 MM PITCH PQFP

    Yeo, C. K. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    Adhesive Flip Chip Bonding in a Miniaturized Spectrometer

    Rusanen, O. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Application of Dielectric Binary Mixtures in Electronic Cooling Nucleate Pool Boiling Regime

    Lee, T.-Y. T. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    SMT Feeder Slot Assignment for Predetermined Component Placement Paths

    Moyer, L. K. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    Simultaneous Component Sequencing and Feeder Assignment for High Speed Chip Shooter Machines

    Moyer, L. K. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    A Simulation of Evaporating Meniscus-Driven Flow for Application to Electronics Cooling Design

    Tso, C. P. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    Statistical Process Control for Test and Scan Processes at Final Test Operation of an Integrated Circuit

    Kumar, S. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    The Solderability Evaluation of Surface Mount Components Through the Use of Wetting Balance Analysis

    Huang, C.-Y. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    Book Review: Conductive Adhesives in Electronics Packaging (J. Liu)

    Ruf, C. | Online Contents | 1998
    Verlag: World Scientific , Singapore