Lightweight Electronic Enclosures Using Composite Materials
Advanced Standard Electronic Modules Format-E (SEM-E) Processes for Rapid Prototyping
Microchannel Heat Pipe Cooling of Modules
NATO reference mobility modelling
Reliability Assessment of Multichip Module Technologies via the Tri-Service/NASA RELTECH Program
Assuring Known Good Die (KGD) for Reliable, Cost Effective MCMs
The Impact of Advanced Packaging Technology on Modular Avionics Architectures
The IEEE Scalable Coherent Interface - An Approach for a Unified Avionics Network
The Design and Manufacturing Development of an Active Silicon Substrate MCM
Standard Hardware Acquisition and Reliability Program (SHARP) Advanced SEM-E Packaging
Electromagnetic Compatibility Effects of Advanced Packaging Configurations
Ultra-Reliable Digital Avionics (URDA) Processor
A Technique for Increasing the Bandwidth of High Performance Electrical Backplanes
Boitiers Composites pour Equipements Electroniques Aeroportes: Une Etude Technologique et CEM
The Demise of Plastic Encapsulated Microcircuit Myths
The Advanced Avionics Subsystem Technology Demonstration Program
High Density Monolithic Packaging Technology for Digital/Microwave Avionics
Liquid Flow-Through Cooling of Electronic Modules
Alimentations Modulaires pour une Architecture Distribuee
MCMs for Avionics - Technology Selection and Intermodule Interconnection
Power management for the NATO warfighter : final report of Task Group 27
Improving Multichip Module (MCM) Design and Reliability Using the Intelligent MCM Analyzer
High Performance Backplane Components for Modular Avionics