Synonyme wurden verwendet für: encapsulation
Suche ohne Synonyme: keywords:(encapsulation)

121–140 von 166 Ergebnissen
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    Evaluation Polyurethane Elastomeric Compound Cps-796-65, Type II

    R. H. Flack | NTIS | 1966
    Schlagwörter: Encapsulation

    Qualification of a spin apply, photodefinable polymer for packaging of automotive circuits

    Wyant, J.L. / Schuckert, C.C. | Tema Archiv | 2000
    Schlagwörter: Flip-Chip-Verkapselung

    Evaluation Polyurethane Elastomeric Compound Uralane 5712, Type III

    R. H. Flack | NTIS | 1966
    Schlagwörter: Encapsulation

    Underwater Locator Beacon Detection Ranges for Fuselage Encapsulated Recorders

    R. B. Fisher / P. M. Rich | NTIS | 1968
    Schlagwörter: Encapsulation

    Encapsulation, Electronics, Eccofoam

    F. N. Le Doux | NTIS | 1965
    Schlagwörter: Encapsulation

    Optimal sizing of powder handling horizontal capsule pipelines

    Agarwal, V.C. / Rakesh Mishra | Tema Archiv | 1998
    Schlagwörter: Verkapseln

    Model for BGA and CSP reliability in automotive underhood applications

    Lall, P. / Islam, N. / Suhling, J. | Tema Archiv | 2003
    Schlagwörter: Chip-Größen-Kapselung

    Structural Design of Pavements for Light Aircraft

    D. M. Ladd / F. Parker / A. T. Pereira | NTIS | 1976
    Schlagwörter: Encapsulation

    Design and characteristics of submarine optical fiber cable

    Ishihara, K. / Kawata, O. / Yoshizawa, N. | Tema Archiv | 1985
    Schlagwörter: DRUCKFESTE KAPSELUNG

    Lead free alloys for flip chip bumping

    Jung, E. / Aschenbrenner, R. / Kallmayer, C. et al. | Tema Archiv | 2001
    Schlagwörter: Chip-Größen-Kapselung

    300 ampere, 1000 volt hermetic Darlington transistor

    Morozowich, M. | Tema Archiv | 1989
    Schlagwörter: DRUCKFESTE KAPSELUNG

    Automotive package size driven by market demand

    Mellinger, E.M. / Yuska, P. | Tema Archiv | 1990
    Schlagwörter: KAPSELUNG

    Comparison of mechanical reliability of three underfill materials for flip chip bumps on high Tg PCB for automotive applications

    Fabbri, G. / Sartori, C. / Scarano, G. | Tema Archiv | 2001
    Schlagwörter: Chip-on-board-Kapselung

    Integrated Power Amplifier Final Report, Mar. 1964 - Sep. 1965

    T. C. New | NTIS | 1965
    Schlagwörter: Encapsulation

    Accelerated testing of flip chip packages under dynamic load

    Rau, I. / Miessner, R. / Liebing, G. et al. | Tema Archiv | 2001
    Schlagwörter: Flip-Chip-Verkapselung

    Alvin-120 VDC/28 VDC electrical system

    Hosom, D.S. / Forrester, N.C. / Walden, B.B. | Tema Archiv | 1987
    Schlagwörter: KAPSELUNG

    Packaging military and commercial electronics

    Markstein, H.W. | Tema Archiv | 1987
    Schlagwörter: KAPSELUNG