A continuously variable ER damper with energy generation
Micro- Application of Non-Filled Adhesives for Precision Assembly in Microsystems Manufacturing
Intelligent Control of an Internal Supply Chain in the Haxd Disk Drive Industry
Integration of Environmental Factors in Pre-Layout Design Optimization for Printed Circuit Boards
RELIABILITY STUDY OF POLYMER ADHESIVE BUMP INTERCONNECTIONS
ANISOTROPIC ADHESIVES FOR FLIP-CHIP BONDING
Flow Boiling Heat Transfer of Electronic Chips in Horizontal Channels
An Integrated Rapid Modeling Environment for Managing Wafer Fabrication Facilities
Analysing the strategic implications of interconnect technologies
Tolerance analysis and synthesis across assemblies : state-of-the-art review
The Characteristics of Sand Dunes and its Stabilization in China
A NOVEL CIRCUIT FABRICATION TECHNIQUE USING OFFSET LITHOGRAPHY
Adhesive Flip Chip Bonding on Flexible Substrates
Thermal Model of a Component Package for System Level Applications
ELECTRICAL CONDUCTION MODELS FOR ISOTROPICALLY CONDUCTIVE ADHESIVES
Analyzing the Natural Resting Aspects of a Component by its Centroid Solid Angle
Optimization of a Copper Pattern Plating Process with Planned Experimentation and Response Surface
Adhesive Flip Chip Bonding in a Miniaturized Spectrometer
Application of Dielectric Binary Mixtures in Electronic Cooling Nucleate Pool Boiling Regime
Computer simulation of solder paste flow, part II : Flow out of a stencil aperture
Application of ink screening models to solder paste printing in SMT assembly
THERMAL DISSIPATION CHARACTERISTICS OF A TAPE AUTOMATED BONDING ELECTRONIC PACKAGE
A REVIEW ON DIRECT LIQUID COOLING CHANNEL FLOW WITH SINGLE-PHASE FOR ELECTRONIC SYSTEMS
A Review on Cooling by Channel Flow Boiling for Electronic Systems
Effects of Gap Height on Conduction within Anisotropic Conducting Adhesive Assemblies
Application of Polymer-Thick-Film-Technology (PTF) for Environmentally Friendly Electronic Devices
An Efficient Assembly Sequencing Heuristic for Printed Circuit Board Configurations
Thermal Management for the Robustness Improvement of Double Sided SMT Solder Reflow
Comprehensive Review of Natural and Mixed Convection Heat Transfer Models for Circuit Board Arrays
A Study of Solderability and Solder Spreading for SMT Open Joints
Hierarchical Renormalisation and Stretched Exponential Relaxations
Novel Magnetic-Field-Induced Minigap and Transport in Coupled Double QuantumWells
Hygrothermal Reliability Evaluation of Plastic IC Packages with Computer-Aided Engineering Tools
Analyzing the Natural Resting Aspects of Plastic Parts in a Vibratory Bowl Feeder
SMT Feeder Slot Assignment for Predetermined Component Placement Paths
Simultaneous Component Sequencing and Feeder Assignment for High Speed Chip Shooter Machines
A Simulation of Evaporating Meniscus-Driven Flow for Application to Electronics Cooling Design