201–250 von 567 Ergebnissen
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    A continuously variable ER damper with energy generation

    Kim, K.S. / Choi, S.B. / Cheong, C.C. et al. | Tema Archiv | 1997
    Verlag: World Scientific , Singapore

    Micro- Application of Non-Filled Adhesives for Precision Assembly in Microsystems Manufacturing

    Bauer, A. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    Calculation of the Single Particle Green's Function of Interacting Fermions in Arbitrary Dimension via Functional Bosonization

    Kopietz, P. | British Library Conference Proceedings | 1996
    Verlag: World Scientific , Singapore

    Intelligent Control of an Internal Supply Chain in the Haxd Disk Drive Industry

    Zhao, Z. Y. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    Integration of Environmental Factors in Pre-Layout Design Optimization for Printed Circuit Boards

    Siddhaye, S. | Online Contents | 1998
    Verlag: World Scientific , Singapore

    RELIABILITY STUDY OF POLYMER ADHESIVE BUMP INTERCONNECTIONS

    Rösner, Bela | Online Contents | 1995
    Verlag: World Scientific , Singapore

    ANISOTROPIC ADHESIVES FOR FLIP-CHIP BONDING

    Kivilahti, J. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Flow Boiling Heat Transfer of Electronic Chips in Horizontal Channels

    Kristiansen, H. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    An Integrated Rapid Modeling Environment for Managing Wafer Fabrication Facilities

    Souza, R. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Analysing the strategic implications of interconnect technologies

    Dolan, T. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Tolerance analysis and synthesis across assemblies : state-of-the-art review

    Ngoi, Bryan Kok Ann | Online Contents | 1994
    Verlag: World Scientific , Singapore

    The Characteristics of Sand Dunes and its Stabilization in China

    Zhu, Z. / Yang, Y. / International Centre for Theoretical Physics et al. | British Library Conference Proceedings | 1989
    Verlag: World Scientific , Singapore

    TECHNOLOGY TRENDS IN ELECTRONICS AND PHOTONICS, THEIR MODELING AND EFFECT ON MANUFACTURING AND ASSEMBLY

    Williams, D. J. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    A NOVEL CIRCUIT FABRICATION TECHNIQUE USING OFFSET LITHOGRAPHY

    Ramsey, B. J. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Adhesive Flip Chip Bonding on Flexible Substrates

    Aschenbrenner, R. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Thermal Model of a Component Package for System Level Applications

    Teng, S. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    ELECTRICAL CONDUCTION MODELS FOR ISOTROPICALLY CONDUCTIVE ADHESIVES

    Li, Li | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Analyzing the Natural Resting Aspects of a Component by its Centroid Solid Angle

    Ngoi, B. K. A. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Optimization of a Copper Pattern Plating Process with Planned Experimentation and Response Surface

    Poon, G. K. K. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Adhesive Flip Chip Bonding in a Miniaturized Spectrometer

    Rusanen, O. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Application of Dielectric Binary Mixtures in Electronic Cooling Nucleate Pool Boiling Regime

    Lee, T.-Y. T. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Pan Asian Electronic Business '94

    Souza, R. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Computer simulation of solder paste flow, part II : Flow out of a stencil aperture

    Mannan, S. H. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Application of ink screening models to solder paste printing in SMT assembly

    Mannan, S. H. | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Wind Experiments

    Moeller, J. T. / International Centre for Theoretical Physics / University of Khartoum | British Library Conference Proceedings | 1989
    Verlag: World Scientific , Singapore

    Special issue: Selected papers from the Third International Conference on Electrical Engineering and Information Technologies for Rail Transportation (EITRT2017)

    International Conference on Electrical and Information Technologies for Rail Transportation | TIBKAT | 2018
    Verlag: World Scientific , New Jersey , London , Singapore

    THERMAL DISSIPATION CHARACTERISTICS OF A TAPE AUTOMATED BONDING ELECTRONIC PACKAGE

    Yang, L. Y. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    A REVIEW ON DIRECT LIQUID COOLING CHANNEL FLOW WITH SINGLE-PHASE FOR ELECTRONIC SYSTEMS

    Xu, G. P. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    A Review on Cooling by Channel Flow Boiling for Electronic Systems

    Xu, G. P. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    IN SITU STUDY OF SOLDER PASTE BEHAVIOR DURING REFLOW USING THE HOT-STAGE ENVIRONMENTAL SCANNING ELECTRON MICROSCOPE

    Natishan, M. E. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Effects of Gap Height on Conduction within Anisotropic Conducting Adhesive Assemblies

    Mannan, S. H. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Application of Polymer-Thick-Film-Technology (PTF) for Environmentally Friendly Electronic Devices

    Fischer, T. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    An Efficient Assembly Sequencing Heuristic for Printed Circuit Board Configurations

    Moyer, L. K. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Thermal Management for the Robustness Improvement of Double Sided SMT Solder Reflow

    Lee, N. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Comprehensive Review of Natural and Mixed Convection Heat Transfer Models for Circuit Board Arrays

    Teerstra, P. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    A Study of Solderability and Solder Spreading for SMT Open Joints

    Teo, K. C. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    Hierarchical Renormalisation and Stretched Exponential Relaxations

    Souletie, J. | British Library Conference Proceedings | 1996
    Verlag: World Scientific , Singapore

    Novel Magnetic-Field-Induced Minigap and Transport in Coupled Double QuantumWells

    Lyo, S. K. / Simmons, J. A. / Harff, N. E. et al. | British Library Conference Proceedings | 1996
    Verlag: World Scientific , Singapore

    Hygrothermal Reliability Evaluation of Plastic IC Packages with Computer-Aided Engineering Tools

    Kuo, A.-Y. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Analyzing the Natural Resting Aspects of Plastic Parts in a Vibratory Bowl Feeder

    Ngoi, B. K. A. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    SMT Feeder Slot Assignment for Predetermined Component Placement Paths

    Moyer, L. K. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    Simultaneous Component Sequencing and Feeder Assignment for High Speed Chip Shooter Machines

    Moyer, L. K. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    A Simulation of Evaporating Meniscus-Driven Flow for Application to Electronics Cooling Design

    Tso, C. P. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    Statistical Process Control for Test and Scan Processes at Final Test Operation of an Integrated Circuit

    Kumar, S. | Online Contents | 1996
    Verlag: World Scientific , Singapore