201–250 von 558 Ergebnissen
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    TECHNOLOGY TRENDS IN ELECTRONICS AND PHOTONICS, THEIR MODELING AND EFFECT ON MANUFACTURING AND ASSEMBLY

    Williams, D. J. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    A NOVEL CIRCUIT FABRICATION TECHNIQUE USING OFFSET LITHOGRAPHY

    Ramsey, B. J. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Adhesive Flip Chip Bonding on Flexible Substrates

    Aschenbrenner, R. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Thermal Model of a Component Package for System Level Applications

    Teng, S. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Toward sustainable and economic smart mobility : shaping the future of smart cities

    Eiza, Max / Cao, Yue / Xu, Lexi | TIBKAT | 2020
    Verlag: World Scientific , New Jersey , London , Singapore

      Toward sustainable and economic smart mobility : shaping the future of smart cities

      Eiza, Max / Cao, Yue / Xu, Lexi | SLUB | 2020
      Verlag: World Scientific , New Jersey , London , Singapore

    THERMAL DISSIPATION CHARACTERISTICS OF A TAPE AUTOMATED BONDING ELECTRONIC PACKAGE

    Yang, L. Y. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    A REVIEW ON DIRECT LIQUID COOLING CHANNEL FLOW WITH SINGLE-PHASE FOR ELECTRONIC SYSTEMS

    Xu, G. P. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    A Review on Cooling by Channel Flow Boiling for Electronic Systems

    Xu, G. P. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    A DECOMPOSITION METHODOLOGY FOR SCHEDULING SEMICONDUCTOR TEST OPERATIONS FOR NUMBER OF TARDY JOB MEASURES

    Yoo, Wook-Sung | Online Contents | 1997
    Verlag: World Scientific , Singapore

    REWORK OF BGA COMPONENTS

    Chung, C. W. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    The Limits of Automating Electronic Component Rework

    Geren, N. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    On Improving the Performance of Hard Disk Drive Final Assembly via Knowledge Intensive Simulation

    Zhao, Z. Y. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    A Computational Model for Forced Convection Cooling in Electronic Components

    Olivos, T. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    A Review of PCB Design for In-Circuit Testability Guidelines and Systems

    Gallagher, C. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Electric Properties of Connections by Anisotropic Conductive Film

    Shiozawa, N. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    Stencil Optimization via Flow Control

    Teo, K. C. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    A Model to Explain SMT Open Circuit Joints Associated with Adjacent Solder Bridges

    Whalley, D. C. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    IN SITU STUDY OF SOLDER PASTE BEHAVIOR DURING REFLOW USING THE HOT-STAGE ENVIRONMENTAL SCANNING ELECTRON MICROSCOPE

    Natishan, M. E. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Effects of Gap Height on Conduction within Anisotropic Conducting Adhesive Assemblies

    Mannan, S. H. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    An Experimental Study of the Self Centering of BGA Packages

    Huang, Y.-W. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Integrated Modeling of Electronics Assembly Systems by Colored Petri Nets

    Tam, H.-Y. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Adhesive Flip Chip Bonding in a Miniaturized Spectrometer

    Rusanen, O. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    Application of Dielectric Binary Mixtures in Electronic Cooling Nucleate Pool Boiling Regime

    Lee, T.-Y. T. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    An intelligent decision support environment for PCB assembly

    Soon, Chong Chin | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Implementation of a decision support system for scheduling semiconductor test operations

    Lee, Chung-Yee | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Wind Tunnel Modeling of Sand Transport Physics and Control

    Iversen, J. D. / International Centre for Theoretical Physics / University of Khartoum | British Library Conference Proceedings | 1989
    Verlag: World Scientific , Singapore

    A Physically Based Wind Erosion Estimation Method

    Gillette, D. A. / International Centre for Theoretical Physics / University of Khartoum | British Library Conference Proceedings | 1989
    Verlag: World Scientific , Singapore

    ANALYSIS OF NATURAL RESTING ASPECTS OF COMPLEX PARTS

    Ngoi, B. K. A. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    A Decision-Support Tool for Printed Circuit Board Assembly

    Ong, N. S. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    An Analysis of Dispatching Rules in a Semiconductor Wafer Fabrication Environment

    McCutchen, T. | Online Contents | 1995
    Verlag: World Scientific , Singapore

    FLOW MODELING OF PQFP DURING TRANSFER MOLDING

    Kuah, T. H. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    EXPERIMENTAL STUDY OF SOLDER JOINT RELIABILITY IN A 256 PIN, 0.4 MM PITCH PQFP

    Yeo, C. K. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    Thermal analysis of IC packages and printed circuit boards

    Tay, A. A. O. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Wire bond parameter optimization study

    Viloria, E. | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Solder paste for tomorrow's electronics manufacturing technology

    Lee, Ning-Cheng | Online Contents | 1994
    Verlag: World Scientific , Singapore

    Simulation and experimental study of a semi-active suspension with an electrorheological damper

    Wu, X.M. / Wong, J.Y. / Sturk, M. et al. | Tema Archiv | 1994
    Verlag: World Scientific , Singapore

    Analysis of despatching policies in semiconductor post-test operations

    Azrak, Marijean | Online Contents | 1993
    Verlag: World Scientific , Singapore

    Design and development of a generic PCBA line simulator

    Souza, Robert | Online Contents | 1993
    Verlag: World Scientific , Singapore

    SMT Feeder Slot Assignment for Predetermined Component Placement Paths

    Moyer, L. K. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    Simultaneous Component Sequencing and Feeder Assignment for High Speed Chip Shooter Machines

    Moyer, L. K. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    A Simulation of Evaporating Meniscus-Driven Flow for Application to Electronics Cooling Design

    Tso, C. P. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    Statistical Process Control for Test and Scan Processes at Final Test Operation of an Integrated Circuit

    Kumar, S. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    The Solderability Evaluation of Surface Mount Components Through the Use of Wetting Balance Analysis

    Huang, C.-Y. | Online Contents | 1996
    Verlag: World Scientific , Singapore

    Theory of Two-Phonon Processes in Atom-Surface Collision: Application to He + Pt(111) System

    Guevenc, Z. B. / Choi, B. H. / Liu, N. L. | British Library Conference Proceedings | 1996
    Verlag: World Scientific , Singapore

    Nonexponential Relaxation of Condensed Matter

    Chamberlin, R. V. | British Library Conference Proceedings | 1996
    Verlag: World Scientific , Singapore

    Critical Dynamics of Diluted Heisenburg Antiferromagnets

    Nakayama, T. | British Library Conference Proceedings | 1996
    Verlag: World Scientific , Singapore

    Application of Polymer-Thick-Film-Technology (PTF) for Environmentally Friendly Electronic Devices

    Fischer, T. | Online Contents | 1997
    Verlag: World Scientific , Singapore

    An Efficient Assembly Sequencing Heuristic for Printed Circuit Board Configurations

    Moyer, L. K. | Online Contents | 1997
    Verlag: World Scientific , Singapore