A NOVEL CIRCUIT FABRICATION TECHNIQUE USING OFFSET LITHOGRAPHY
Adhesive Flip Chip Bonding on Flexible Substrates
Thermal Model of a Component Package for System Level Applications
Toward sustainable and economic smart mobility : shaping the future of smart cities
Toward sustainable and economic smart mobility : shaping the future of smart cities
THERMAL DISSIPATION CHARACTERISTICS OF A TAPE AUTOMATED BONDING ELECTRONIC PACKAGE
A REVIEW ON DIRECT LIQUID COOLING CHANNEL FLOW WITH SINGLE-PHASE FOR ELECTRONIC SYSTEMS
A Review on Cooling by Channel Flow Boiling for Electronic Systems
The Limits of Automating Electronic Component Rework
On Improving the Performance of Hard Disk Drive Final Assembly via Knowledge Intensive Simulation
A Computational Model for Forced Convection Cooling in Electronic Components
A Review of PCB Design for In-Circuit Testability Guidelines and Systems
Electric Properties of Connections by Anisotropic Conductive Film
A Model to Explain SMT Open Circuit Joints Associated with Adjacent Solder Bridges
Effects of Gap Height on Conduction within Anisotropic Conducting Adhesive Assemblies
An Experimental Study of the Self Centering of BGA Packages
Integrated Modeling of Electronics Assembly Systems by Colored Petri Nets
Adhesive Flip Chip Bonding in a Miniaturized Spectrometer
Application of Dielectric Binary Mixtures in Electronic Cooling Nucleate Pool Boiling Regime
An intelligent decision support environment for PCB assembly
Implementation of a decision support system for scheduling semiconductor test operations
Wind Tunnel Modeling of Sand Transport Physics and Control
A Physically Based Wind Erosion Estimation Method
ANALYSIS OF NATURAL RESTING ASPECTS OF COMPLEX PARTS
A Decision-Support Tool for Printed Circuit Board Assembly
An Analysis of Dispatching Rules in a Semiconductor Wafer Fabrication Environment
FLOW MODELING OF PQFP DURING TRANSFER MOLDING
EXPERIMENTAL STUDY OF SOLDER JOINT RELIABILITY IN A 256 PIN, 0.4 MM PITCH PQFP
Thermal analysis of IC packages and printed circuit boards
Wire bond parameter optimization study
Solder paste for tomorrow's electronics manufacturing technology
Simulation and experimental study of a semi-active suspension with an electrorheological damper
Analysis of despatching policies in semiconductor post-test operations
Design and development of a generic PCBA line simulator
SMT Feeder Slot Assignment for Predetermined Component Placement Paths
Simultaneous Component Sequencing and Feeder Assignment for High Speed Chip Shooter Machines
A Simulation of Evaporating Meniscus-Driven Flow for Application to Electronics Cooling Design
The Solderability Evaluation of Surface Mount Components Through the Use of Wetting Balance Analysis
Theory of Two-Phonon Processes in Atom-Surface Collision: Application to He + Pt(111) System
Nonexponential Relaxation of Condensed Matter
Critical Dynamics of Diluted Heisenburg Antiferromagnets
Application of Polymer-Thick-Film-Technology (PTF) for Environmentally Friendly Electronic Devices
An Efficient Assembly Sequencing Heuristic for Printed Circuit Board Configurations