Lightweight Electronic Enclosures Using Composite Materials
Advanced Standard Electronic Modules Format-E (SEM-E) Processes for Rapid Prototyping
Microchannel Heat Pipe Cooling of Modules
NATO reference mobility modelling
Reliability Assessment of Multichip Module Technologies via the Tri-Service/NASA RELTECH Program
Assuring Known Good Die (KGD) for Reliable, Cost Effective MCMs
The Impact of Advanced Packaging Technology on Modular Avionics Architectures
The IEEE Scalable Coherent Interface - An Approach for a Unified Avionics Network
The Design and Manufacturing Development of an Active Silicon Substrate MCM
Standard Hardware Acquisition and Reliability Program (SHARP) Advanced SEM-E Packaging
Electromagnetic Compatibility Effects of Advanced Packaging Configurations
Ultra-Reliable Digital Avionics (URDA) Processor
A Technique for Increasing the Bandwidth of High Performance Electrical Backplanes