Ultra-Reliable Digital Avionics (URDA) Processor
The Impact of Advanced Packaging Technology on Modular Avionics Architectures
The IEEE Scalable Coherent Interface - An Approach for a Unified Avionics Network
The Design and Manufacturing Development of an Active Silicon Substrate MCM
The Demise of Plastic Encapsulated Microcircuit Myths
The Advanced Avionics Subsystem Technology Demonstration Program
Standard Hardware Acquisition and Reliability Program (SHARP) Advanced SEM-E Packaging
Reliability Assessment of Multichip Module Technologies via the Tri-Service/NASA RELTECH Program
Microchannel Heat Pipe Cooling of Modules
MCMs for Avionics - Technology Selection and Intermodule Interconnection
Liquid Flow-Through Cooling of Electronic Modules
Lightweight Electronic Enclosures Using Composite Materials
Improving Multichip Module (MCM) Design and Reliability Using the Intelligent MCM Analyzer
High Performance Backplane Components for Modular Avionics
High Density Monolithic Packaging Technology for Digital/Microwave Avionics