Advanced Standard Electronic Modules Format-E (SEM-E) Processes for Rapid Prototyping
Microchannel Heat Pipe Cooling of Modules
Lightweight Electronic Enclosures Using Composite Materials
Reliability Assessment of Multichip Module Technologies via the Tri-Service/NASA RELTECH Program
Assuring Known Good Die (KGD) for Reliable, Cost Effective MCMs
The IEEE Scalable Coherent Interface - An Approach for a Unified Avionics Network
The Impact of Advanced Packaging Technology on Modular Avionics Architectures
The Design and Manufacturing Development of an Active Silicon Substrate MCM
Standard Hardware Acquisition and Reliability Program (SHARP) Advanced SEM-E Packaging
Electromagnetic Compatibility Effects of Advanced Packaging Configurations
Ultra-Reliable Digital Avionics (URDA) Processor
A Technique for Increasing the Bandwidth of High Performance Electrical Backplanes
Boitiers Composites pour Equipements Electroniques Aeroportes: Une Etude Technologique et CEM
High Density Monolithic Packaging Technology for Digital/Microwave Avionics