Current avionics fiber-optic networks utilize light-emitting diode (LED)-based transmitter optical sources owing to their established high reliability over the commercial and military avionics temperature regimes. One shortcoming of LED-based transmitters is the limited modulation speed and low output power of the LED devices. Recently published high temperature reliability data on commercial-off-the-shelf (COTS) diode lasers appears promising for realizing higher speed (i.e. >1 Gb/s) optical interconnects in avionics systems. Although ruggedized hermetic packaging has been developed for avionics optoelectronic modules, the application of newer generation commercial sector packaging to reduce optoelectronic module production costs is under examination. 'Glob-top' sealed chip-on-board, passive alignment silicon micro-optical bench, and non-hermetic laser and detector packaging technologies offer potential cost-reductions in avionics optoelectronic modules. However, the reliability of these new laser sources and packaging options has yet to be thoroughly evaluated for the harsh commercial and military avionics environment.
Emerging opportunities for applying COTS optoelectronics in avionics fiber-optic networks
1999
13 Seiten, 48 Quellen
Aufsatz (Konferenz)
Englisch
`Emerging opportunities for applying COTS optoelectronics in avionics fiber-optic networks'
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