Examples of modern military and commercial avionics packaging are shown in the following three systems. The first is a military avionics system developed at Sperry Aerospace and Marine Group, Albuquerque, NM. This system employs chip carriers, coefficient of thermal expansion matching and dense multilayer boards, including a complex rigid/flex assembly designed to eliminate all discrete wiring. The second system is a commercial package from Sundstrand Data Control, Redmond, Wash., designed for high density, reliability and simplified cooling. The third system is a commercial unit from Boeing Electronics, Seattle, Wash., that features rapid maintenance.


    Zugriff

    Zugriff über TIB

    Verfügbarkeit in meiner Bibliothek prüfen


    Exportieren, teilen und zitieren



    Titel :

    Packaging military and commercial electronics


    Weitere Titelangaben:

    Kapselung militaerischer und kommerzieller Elektronik


    Beteiligte:

    Erschienen in:

    Erscheinungsdatum :

    1987


    Format / Umfang :

    5 Seiten


    Medientyp :

    Aufsatz (Zeitschrift)


    Format :

    Print


    Sprache :

    Englisch




    Packaging military electronics

    Markstein, H.W. | Tema Archiv | 1980


    Military electronics: packaging for land, sea and air

    Markstein, H.W. | Tema Archiv | 1985



    Military & aerospace electronics

    TIBKAT | Vol. 1, no. 1 (Jan. 1990)-


    CONSOLIDATED ELECTRONICS PACKAGING

    RIEPLING JEFFREY M / GARRONE RYAN J / WOLF PHILIPP J | Europäisches Patentamt | 2023

    Freier Zugriff