Plastic Encapsulated Microelectronics (PEMs) components are used in increasing numbers in military applications. Influencing factors are improving reliability, greater availability and federal initiatives for use. This discussion will focus on efforts to introduce plastic encapsulated microcircuits to a highly complex, highly integrated military product. The emphasis of this paper will be on Reliability Testing of these Components. Reliability testing of PEM's for military applications has been somewhat limited in 'high-end' devices and packages. This discussion will focus on testing of a wide range of die sizes including large die (>=0.5' per side), and a wide range of packages, including large packages (up to 2'x2' per side) for both custom and off-the-shelf commercial packages.
ASIC/MCM and microcircuit testing using commercial practices
ASIC/MCM- und Mikroschaltungsprüfung mit kommerziellen Methoden
1996
13 Seiten, 8 Bilder, 1 Tabelle
Aufsatz (Konferenz)
Englisch
ASIC/MCM and Microcircuit Testing Using Commercial Practices
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