Recent trends in automotive electronics indicate an increasing request for more complex, more performant, more reliable, small sized, low weight and low cost electronic control units (E.C.U.). Meeting these requirements is more and more a challenge for the engineers. Power dissipation is one of the major aspects of the challenge, but today the problem is non more just dimensioning heath-sinks. A global approach based on co-design concept is described. Co-design with the systemist to understand the real worst-case power dissipation, to avoid over design. Co-design with the silicon foundry to exploit the opportunities coming from silicon technology evolution. Tight co-operation with assembly technologists to identify, in each case, the best assembly and packing technology. Data, trends and examples are presented to support the approach.
Power management a success factor for future automotive electronics
Integration der Leistungselektronik in die Kraftfahrzeugelektrik
1995
5 Seiten, 1 Bild, 4 Tabellen, 4 Quellen
Aufsatz (Konferenz)
Englisch
Power management a success factor for future automotive electronics
British Library Conference Proceedings | 1995
|Automotive electronics: the future?
Tema Archiv | 1989
|The future of automotive electronics
Kraftfahrwesen | 2000
|Present and future automotive electronics
Tema Archiv | 1993
|The future of automotive electronics
Tema Archiv | 2000
|