Lead as a die attach material can be substituted by AuSn diffusion solder. Temperature cycling of electronic components is a highly accepted test method to prove the reliability of a component with respect to thermo-mechanical loads. The reduction of test time is possible by using temperature shock tests. For Pb die attach, first delamination is observed after 100 thermal cycles, whereas changing the die attach to diffusion solder does not lead to delamination until 700 thermal cycles. The cycle resistance is better even for chips with standard silicon thickness (205 mum). Decreasing the chip thickness down to 60 mum the number of cycles can be increased by 500 without detectable delamination. An enormous gain of time is possible if thermal shocks are used instead of thermal cycling. The range of applicability of thermal shocks is however still an open question.
Can temperature shock tests speed up die attach delamination for automotive components significantly? A comparison between lead and lead-free assembly
Können Temperaturschocktests die Die-Attach-Schichtablösung bei Automobilkomponenten erheblich beschleunigen? Ein Vergleich zwischen Blei- und bleifreier Montage
Micromaterials and Nanomaterials ; 9 ; 88-91
2009
4 Seiten, 4 Bilder, 5 Quellen
Aufsatz (Zeitschrift)
Englisch
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