The importance of the presence of underfill in flip chip technology bumped on high Tg (glass transition temperature) HDI PCB (high density interconnection printed circuit board) is checked. Three different underfills are compared in term of stress distribution at ambient and at high temperature, and in term of mechanical reliability after thermal aging by means of C-SAM, microsections, SEM and electrical resistance measurements. Thermal fatigue tests are performed in order to reproduce environmental conditions typical of use in automotive electronics. Different behaviours of the three underfills are found but no failures are detected.


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    Titel :

    Comparison of mechanical reliability of three underfill materials for flip chip bumps on high Tg PCB for automotive applications


    Beteiligte:
    Fabbri, G. (Autor:in) / Sartori, C. (Autor:in) / Scarano, G. (Autor:in)


    Erscheinungsdatum :

    2001


    Format / Umfang :

    16 Seiten, 8 Quellen



    Medientyp :

    Aufsatz (Zeitschrift)


    Format :

    Print


    Sprache :

    Englisch




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