As the core of power electronic devices, the reliability of IGBT is paid more and more attention. Accelerated aging test has become the most widely used research method. The failure mechanism of IGBT module is analyzed; the power cycle circuits and control strategies commonly used in existing AC/DC aging platforms are compared to provide reference for selecting the optimal scheme. Compared with AC aging platform, DC aging platform has the advantages of simple structure and easy access to state parameters, which is more suitable for AC aging platform. Thermal network method and finite element analysis method are used to obtain the junction temperature of IGBT module.


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    Titel :

    Research on Accelerated Aging Test and Junction Temperature Detection Method of IGBT


    Weitere Titelangaben:

    Lect. Notes Electrical Eng.


    Beteiligte:
    Jia, Limin (Herausgeber:in) / Qin, Yong (Herausgeber:in) / Liang, Jianying (Herausgeber:in) / Liu, Zhigang (Herausgeber:in) / Diao, Lijun (Herausgeber:in) / An, Min (Herausgeber:in) / Sha, Yanbei (Autor:in) / Pan, Guangze (Autor:in) / Guo, Mengxue (Autor:in) / Wei, Lu (Autor:in)

    Kongress:

    International Conference on Electrical and Information Technologies for Rail Transportation ; 2021 October 21, 2021 - October 23, 2021



    Erscheinungsdatum :

    2022-02-22


    Format / Umfang :

    7 pages





    Medientyp :

    Aufsatz/Kapitel (Buch)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch




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