The principle of inspecting solder joints by holographic interferometric technique is introduced. The criterion of discriminating the flaws is suggested. The results are given and testified by metallographical sectioning.
Laser Holographic Inspection Of Solder Joints On Printed Circuit Board (PCB)
Holography Applications ; 1986 ; Beijung,China
Proc. SPIE ; 0673
1988-01-15
Aufsatz (Konferenz)
Elektronische Ressource
Englisch
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