This specification covers a single-component, unfilled, heat-reactive, thermosetting, acetylene-substituted, aromatic-polyimide resin in the form of dry solid powder or particles. The resin thermally cures to a polyimide polymer.
RESIN, POLYIMIDE, LAMINATING AND MOLDING High Temperature Resistant, 370°C or 700°F Unfilled, Addition Polymer
15.01.1977
Aufsatz (Konferenz)
Englisch
SAE Technical Papers | 1992
SAE Technical Papers | 2011
SAE Technical Papers | 1996
RESIN, POLYIMIDE, SEALING High-Temperature Resistant, 315°C (600°F) Unfilled
SAE Technical Papers | 2011
RESIN, POLYIMIDE, SEALING High-Temperature Resistant, 315 °C (600 °F) Unfilled
SAE Technical Papers | 1993