The intent of this paper is to present updates to and further developments of the automotive electronic component reliability prediction models previously developed and summarized in SAE paper 840486. The relatively simplistic models presented previously have been further developed to account for factors such as temperature, decreasing failure rate with time, and nonoperating period failure rates. Models have been developed for microcircuits, diodes, transistors, capacitors, and resistors. These efforts are part of an on-going activity of the electronic reliability subcommittee of the SAE's electronics committee to analyze failure rate information on automotive electronic components and provide the automotive community with a means to predict electronic reliability.
Automotive Electronic Reliability Prediction
Sae Technical Papers
SAE International Congress and Exposition ; 1987
01.02.1987
Aufsatz (Konferenz)
Englisch
Automotive electronic reliability prediction
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