This specification covers a single-component, heat-reactive, thermosetting aromatic system which thermally cures to form a polyimide polymer structure. This document has been determined to contain basic and stable technology which is not dynamic in nature.
Resin, Polyimide, Laminating High Temperature Resistant, 315 °C (599 °F)
16.11.2016
Aufsatz (Konferenz)
Englisch
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