This specification covers a single-component, heat-reactive, thermosetting aromatic system which thermally cures to form a polyimide polymer structure.
RESIN, POLYIMIDE, LAMINATING High Temperature Resistant, 315°C (600°F)
1979-10-01
Aufsatz (Konferenz)
Englisch
Resin, Polyimide, Laminating High Temperature Resistant, 315 °C (599 °F)
SAE Technical Papers | 2016
RESIN, POLYIMIDE, LAMINATING High Temperature Resistant, 315°C (600°F)
SAE Technical Papers | 1991
Resin, Polyimide, Laminating High Temperature Resistant, 315 °C (599 °F)
SAE Technical Papers | 2010
Resin, Polyimide, Laminating High Temperature Resistant, 315 °C (599 °F)
SAE Technical Papers | 1998
RESIN, POLYIMIDE, LAMINATING High Temperature Resistant, 315° C (599° F)
SAE Technical Papers | 1974