Begins with a review of semiconductor wire bonding techniques utilizing both thermocompression and ultrasonic methods. Next, disadvantages of using interconnect leadwires are covered. Finally, a description of leadless face bonding is included with emphasis on the important functions in state-of-the-art techniques as well as on simplicity, accuracy and repeatability.
Semiconductor: Wire Bonding and Face Bonding Considerations and Comparisons
Sae Technical Papers
Micro Electronic Packaging Conference ; 1968
01.02.1968
Aufsatz (Konferenz)
Englisch
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