Begins with a review of semiconductor wire bonding techniques utilizing both thermocompression and ultrasonic methods. Next, disadvantages of using interconnect leadwires are covered. Finally, a description of leadless face bonding is included with emphasis on the important functions in state-of-the-art techniques as well as on simplicity, accuracy and repeatability.


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    Titel :

    Semiconductor: Wire Bonding and Face Bonding Considerations and Comparisons


    Weitere Titelangaben:

    Sae Technical Papers


    Beteiligte:

    Kongress:

    Micro Electronic Packaging Conference ; 1968



    Erscheinungsdatum :

    01.02.1968




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




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