Foils of manganin substituted for copper foils ordinarily serving as electrical conductors on tapes used in tape automated bonding (TAB) in electronic circuits. Modification makes possible to apply TAB technology to circuits in which substantial gradients of temperature exist under design operating conditions. Other advantages include high reliability, automated assembly, and automated testing.


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    Titel :

    Lower-Thermal-Conductivity Tapes For Tape Automated Bonding


    Beteiligte:

    Erschienen in:

    Erscheinungsdatum :

    01.04.1996



    Medientyp :

    Sonstige


    Format :

    Keine Angabe


    Sprache :

    Englisch





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