Vaporization-cooled heat sink proposed for use during soldering of multiple electrical leads of packaged electronic devices to circuit boards. Heat sink includes compliant wicks held in grooves on edges of metal fixture. Wicks saturated with water. Prevents excessive increases in temperature at entrances of leads into package.
Multilead, Vaporization-Cooled Soldering Heat Sink
NASA Tech Briefs ; 19 , 4
01.04.1995
Sonstige
Keine Angabe
Englisch
Multilead, Vaporization-Cooled Soldering Heat Sink
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