Vaporization-cooled heat sink proposed for use during soldering of multiple electrical leads of packaged electronic devices to circuit boards. Heat sink includes compliant wicks held in grooves on edges of metal fixture. Wicks saturated with water. Prevents excessive increases in temperature at entrances of leads into package.


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    Titel :

    Multilead, Vaporization-Cooled Soldering Heat Sink


    Beteiligte:
    Rice, John (Autor:in)

    Erschienen in:

    Erscheinungsdatum :

    01.04.1995



    Medientyp :

    Sonstige


    Format :

    Keine Angabe


    Sprache :

    Englisch


    Schlagwörter :




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