Simple hand-held tool removes leadless, surface-mounted integrated circuits (IC's) from printed-circuit boards. Nozzle used with hot-air gun of type used to apply heat-shrink tubing or with some other source of hot gas. Rectangular end of nozzle and deflector shape airflow pattern to concentrate heat directly on soldering pads located around edge of IC's to heat them quickly and uniformly.
Hot-Gas Nozzle for Desoldering Leadless IC's
NASA Tech Briefs ; 11 , 7
01.07.1987
Sonstige
Keine Angabe
Englisch
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