New concept for slicing silicon ingots into wafers promises to increase production rates and improve yields of good wafers, thereby reducing cost of manufacturing silicon solar cells. In proposed wafer slicer, stack of ganged blades cuts group of silicon ingots simultaneously. Blades cut horizontally while ingots rotate about their vertical axes.
High-Production Silicon-Ingot Slicer
NASA Tech Briefs ; 7 , 2
1983-05-01
Sonstige
Keine Angabe
Englisch
Stress Analysis of a Silicon-Wafer Slicer Cutting the Crystal Ingot
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