Report discusses how effects of moisture and other factors causing bridging between conductors can be prevented. Study details how several factors such as contaminants, large packages, high voltage, narrow conductor spacing and temperature contribute to moisture problems.
Eliminating gold migration in microcircuits
NASA Tech Briefs ; 3 , 4
1979-03-01
Sonstige
Keine Angabe
Englisch
Emerald Group Publishing | 2007
Coatings for hybrid microcircuits
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|Holographic lithography for microcircuits
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|Sealing microcircuits with adhesives
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|Removing overcoatings from microcircuits
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|