Report discusses how effects of moisture and other factors causing bridging between conductors can be prevented. Study details how several factors such as contaminants, large packages, high voltage, narrow conductor spacing and temperature contribute to moisture problems.


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    Titel :

    Eliminating gold migration in microcircuits


    Beteiligte:

    Erschienen in:

    Erscheinungsdatum :

    1979-03-01



    Medientyp :

    Sonstige


    Format :

    Keine Angabe


    Sprache :

    Englisch




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