We present a survey of the application of micromachining techniques for the fabrication of THz-components. Micro-machining of new THz- devices based on deep trench etching of silicon is discussed with respect to its capability to generate complex 3-dimensional geometries with high aspect ratios (ARs) and to meet the high mechanical requirements for THz-components. First results for the application of deep trench etching for the design of a branch-line coupler for 600 GHz is discussed. We emphasize the potential of silicon based microstructures for manufacturing new devices and focus on technological issues.
Technological issues for micromachining of new passive THz-components based on deep-trench silicon etching
2004-01-01
199531 byte
Aufsatz (Konferenz)
Elektronische Ressource
Englisch
British Library Conference Proceedings | 2001
|NTRS | 1988
|High aspect ratio micromachining by synchrotron radiation direct photo-etching
British Library Online Contents | 1998
|Side airbag sensor in silicon micromachining
Kraftfahrwesen | 1999
|Silicon Bulk Micromachining in Tohoku University
British Library Online Contents | 1996
|