Recently, parallel optical interconnect (POI) prototypes and products have been designed to meet short distance (<200 meters) computer system and telecommunications switch system applications with low cost as a paramount objective. Optoelectronic chips and optical components were chosen for ease in packaging. This paper will describe the chips, packaging, cabling, design and testing tools, and system level testbeds developed for two of these projects: Jitney and OETC.


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    Titel :

    Parallel optical interconnect-a cost performance breakthrough


    Beteiligte:
    Crow, J. (Autor:in)


    Erscheinungsdatum :

    01.01.1996


    Format / Umfang :

    216695 byte




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



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