New bonding processes between TCP and glass panel with ACF using HPDL are investigated. Results showed that this method can solve conventional bonding problems caused by pressure unbalance and thermal expansion mismatch of hot plate.


    Zugriff

    Zugriff prüfen

    Verfügbarkeit in meiner Bibliothek prüfen

    Bestellung bei Subito €


    Exportieren, teilen und zitieren



    Titel :

    A New Method of Anisotropic Conductive Film Bonding by High Power Diode Laser(HPDL)


    Beteiligte:
    Kwang Hyun Ryu, (Autor:in) / Namic Kwon, (Autor:in) / Myung Hee Seo, (Autor:in) / Myung Hoon Lee, (Autor:in) / Gi Jung Nam, (Autor:in) / No Heung Kwak, (Autor:in)


    Erscheinungsdatum :

    2005-01-01


    Format / Umfang :

    1384180 byte




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch




    Corrosion-resistant nickel superalloy coatings laser clad with a 6-kW high-power diode laser (HPDL) [4831-14]

    Tuominen, J. / Honkanen, M. / Hovikorpi, J. et al. | British Library Conference Proceedings | 2003


    High-power diode laser bonding process between tape-carrier package and a glass panel with anisotropic conductive film [5662-50]

    Nam, G.-J. / Seo, M.-H. / Hong, Y.-S. et al. | British Library Conference Proceedings | 2004


    Transformation hardening of torsion springs with HPDL

    Drenker,A. / Kaierle,S. / Schuermann,B. et al. | Kraftfahrwesen | 2000


    00LA010 Transformation Hardening of Torsion Springs with HPDL

    Drenker, A. / Kaierle, S. / Schurmann, B. et al. | British Library Conference Proceedings | 2000