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    Titel :

    High-power diode laser bonding process between tape-carrier package and a glass panel with anisotropic conductive film [5662-50]


    Beteiligte:
    Nam, G.-J. (Autor:in) / Seo, M.-H. (Autor:in) / Hong, Y.-S. (Autor:in) / Lee, S.-U. (Autor:in) / Moon, S.-W. (Autor:in) / Ryu, K.-H. (Autor:in) / Kwon, N.-I. (Autor:in) / Kwak, N.-H. (Autor:in) / Miyamoto, Isamu / SPIE

    Kongress:

    International symposium; 5th, Fifth international symposium on laser precision microfabrication ; 2004 ; Nara, Japan



    Erscheinungsdatum :

    2004-01-01


    Format / Umfang :

    6 pages


    Anmerkungen:

    Also known as LPM 2004.




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




    Laser machinable glass [5662-06]

    Koyo, H. / Shojiya, M. / Tsunetomo, K. et al. | British Library Conference Proceedings | 2004


    A New Method of Anisotropic Conductive Film Bonding by High Power Diode Laser(HPDL)

    Kwang Hyun Ryu, / Namic Kwon, / Myung Hee Seo, et al. | IEEE | 2005


    Microfabrication of glass plates by nanosecond FHG Nd:YAG laser [5662-19]

    Nakamura, S. / Tanaka, S. / Ito, Y. et al. | British Library Conference Proceedings | 2004


    Laser cutting and sealing methods of capillary glass tube [5662-25]

    Nam, G.-J. / Seo, M.-H. / Ryu, K.-H. et al. | British Library Conference Proceedings | 2004


    Nanoscale modification of DLC film surfaces with femtosecond laser pulses [5662-120]

    Yasumaru, N. / Miyazaki, K. / Kiuchi, J. et al. | British Library Conference Proceedings | 2004