This study explores multi-drop interconnections over point to point interconnections. However, high data rate point-to-point electrical transmission lines make multi-drop interconnections very difficult to implement at high speeds. For high speed multi-drop processor to memory interconnections, this paper proposes that optical interconnections offer a simple procedure to design and implement alternative to point to point electrical interconnections. The design complexity of these optical interconnections is similar to lower speed multi-drop electrical interconnections that are currently the dominant architectural implementation in current computing systems.


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    Titel :

    Optical chip-to-chip interconnects for memory systems


    Beteiligte:
    Bourdreaux, O. (Autor:in) / Sang-Yeon Cho, (Autor:in) / Jaemin Shin, (Autor:in) / Chellappa, A. (Autor:in) / Schimmel, D. (Autor:in) / Brooke, M. (Autor:in) / Jokerst, N.M. (Autor:in)


    Erscheinungsdatum :

    01.01.2003


    Format / Umfang :

    161770 byte





    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



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