The thermally induced stresses in the laser welding technique for semiconductor laser packaging are calculated by using the finite-element method (FEM). Results obtained from stainless-to-Kovar joints indicate that the Kovar with an Au coating shows a higher stress than that without a coating. There is satisfactory agreement between experimental results and the finite-element predictions that the higher stresses induced by Au in Kovar during the welding process are a possible cause for surface cracks.


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    Titel :

    Thermally induced stresses in semiconductor laser packaging


    Beteiligte:
    Yang, I.D. (Autor:in) / Wang, W.H. (Autor:in) / Kuang, J.H. (Autor:in) / Cheng, W.H. (Autor:in)


    Erscheinungsdatum :

    1996-01-01


    Format / Umfang :

    139443 byte




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



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