This paper covers some of the design, inspection, and test tradeoffs involved in creating modern high-performance MCMs for both military and high-end commercial applications with an adverse environment. Some current military design, inspection and qualification requirements need to be reviewed for their true value. On the other hand, design features can be incorporated to ensure that system performance and reliability are enhanced, even as the amount and cost of inspection and testing are reduced. As the influence of military business declines with respect to the commercial marketplace, common solutions to common problems must be found.<>


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    Titel :

    Multi-chip modules for military and adverse environment applications


    Beteiligte:
    Port, R.M. (Autor:in)


    Erscheinungsdatum :

    01.01.1993


    Format / Umfang :

    331903 byte




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch




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