The packaging of semiconductor optical devices in applications which require high coupling efficiencies as well as high reliability remains a challenging area. Especially for applications to 10 Gbps optical communication systems, module design and assembly are very important in terms of electrical, optical, and mechanical stability. In this paper, we discuss the fabrication of a 10 Gbps direct intensity modulated laser diode module using proper package design and laser welding techniques for the inhomogeneous materials of Cu-W and stainless steel (SUS304L).


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    Titel :

    Fabrication of 10 Gbps laser diode module using laser welding technique


    Beteiligte:
    Kang, S.G. (Autor:in) / Song, M.K. (Autor:in) / Park, S.S. (Autor:in) / Hwang, N. (Autor:in) / Lee, H.T. (Autor:in) / Pyun, K.E. (Autor:in)


    Erscheinungsdatum :

    01.01.1996


    Format / Umfang :

    382970 byte




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



    Fabrication of 10Gps Laser Diode Module Using Laser Welding Technique

    IEEE; Lasers and Electro-Optics Society | British Library Conference Proceedings | 1996




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