A workstation that enables real-time measurement of the ablation depth while micromachining with femtosecond laser pulses is demonstrated. This method uses spectral interferometry to measure the ablation depth while cutting with an amplified pulse.
Development of a novel femtosecond micromachining workstation using spectral interferometry
(CLEO). Conference on Lasers and Electro-Optics, 2005. ; 3 ; 2166-2168 Vol. 3
2005-01-01
1708281 byte
Aufsatz (Konferenz)
Elektronische Ressource
Englisch
Development of a Novel Femtosecond Micromachining Workstation Using Spectral Interferometry
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