In this paper we discuss the use of modularization techniques for free-space optical interconnections. Specifically, we will describe methods for assembling modules capable of free-space beam combination and routing. These alignment and assembly techniques employ a number of active and passive techniques which are based on the required alignment tolerance. Use of interferometric techniques and Freznel zone plates will be described. In the second part of the talk we will describe methods for module-to-module assembly. The use of rods and plates, L-shaped frames, and glass-to-glass interfaces will be described. In all cases, quantification of the tolerance which these techniques can achieve will be described.


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    Titel :

    Packaging techniques and technologies for free-space optical interconnects


    Beteiligte:
    Plant, D.V. (Autor:in)


    Erscheinungsdatum :

    01.01.1998


    Format / Umfang :

    141091 byte




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



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