A packaging structure has been proposed such that coplanar bond wires may be maintained at a constant height above the device substrate and so function as a transmission line. The characteristic impedance of such a "coplanar wire waveguide" transmission line has been determined as a function of its wire spacing and height above the substrate. The large sensitivity to height above the substrate is shown, thus requiring great precision in maintaining that height in a practical arrangement.
On the design of coplanar waveguide bond wires as transmission lines
01.01.1999
191560 byte
Aufsatz (Konferenz)
Elektronische Ressource
Englisch
On the design of coplanar waveguide bond wires as transmission lines
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