A packaging structure has been proposed such that coplanar bond wires may be maintained at a constant height above the device substrate and so function as a transmission line. The characteristic impedance of such a "coplanar wire waveguide" transmission line has been determined as a function of its wire spacing and height above the substrate. The large sensitivity to height above the substrate is shown, thus requiring great precision in maintaining that height in a practical arrangement.


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    Titel :

    On the design of coplanar waveguide bond wires as transmission lines


    Beteiligte:
    Goossen, K.W. (Autor:in)


    Erscheinungsdatum :

    01.01.1999


    Format / Umfang :

    191560 byte





    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



    On the design of coplanar waveguide bond wires as transmission lines

    IEEE | British Library Conference Proceedings | 1999




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