Two metal-semiconductor-metal (MSM) structures designated as MSMl and MSM2 has been fabricated, and their performances have been compared. In MSM1, only an InGAP buffer layer and a GaAs absorption layer were grown on semi-insulating (100) GaAs substrate. While in MSMZ, another InGaP capping layer (500A) was grown on top of the GaAs absorption layer. All the epilayers were grown by low-pressure organometallic vapor phase epitaxy at 680°C, and the concentrations of the un-intentionally doped InGAP and GaAs layers. The variations of dark current with bias voltage of the two structures before and after thermal treatment are shown.


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    Titel :

    High reliability GaAs metal-semiconductor - metal photodetectors with InGaP buffer and capping laye


    Beteiligte:
    Hung-Pin Shiao, (Autor:in) / Chang-Da Tsai, (Autor:in) / Yuan- Kuang Tu, (Autor:in) / Wei Lin, (Autor:in) / Ching-Ting Lee, (Autor:in) / Yuan-Kuang Tu, (Autor:in)


    Erscheinungsdatum :

    1995-01-01


    Format / Umfang :

    291543 byte




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Elektronische Ressource


    Sprache :

    Englisch



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